We already informed you about the development of the Snapdragon 670 chip. According to rumors, the product can debut at the forthcoming Mobile World Congress (MWC) 2018, which will be held in Barcelona from February 26 to March 1.
According to new information, Snapdragon 670 solution will not use the classical architecture big.LITTLE with quartets of productive and energy efficient cores. Instead, the processor will receive only two powerful Kryo 300 Gold cores (customized version of ARM Cortex-A75) with clock speed up to 2.6 GHz and six energy-efficient Kryo 300 Silver cores (based on ARM Cortex-A55) with a frequency of up to 1.7 GHz.
Snapdragon startup image component 670 will rely on Adreno controller 615 with a base frequency of 430 MHz and a maximum frequency of 700 MHz. It refers to support displays with a resolution of up to 2560 × 1440 pixels (WQHD) and dual chambers.
Devices on the new platform will be able to use flash drives UFS 2.1 and eMMC 5.1. The product will support LPDDR4X RAM, wireless Wi-Fi 802.11ac and Bluetooth 5, as well as GPS navigation systems, GLONASS, the Beidou and Galileo. The built-in LTE modem will allow downloading data through the cellular network at speeds up to 1 Gbit / s.
The production will use 10-nanometer technology Samsung LPP (Low Power Plus).